Description
- Lead packaging technology development including advanced 2.5D/3D packaging. - Work with multi-functional team and lead SoC Package integration efforts. - Package Architecture / Package Integration Innovation - Work with foundry and OSAT to bring packaging solution from concept to HVM. - Drive industry with sophisticated Package solutions, new material development, and specs. - 5% International travel.
Minimum Qualifications
Preferred Qualifications
Pay & Benefits
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